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Reliable prediction of the behaviour of structures made from polymers is a topic under considerable investigation in engineering practice. Especially, if the structure is subjected to dynamic loading, constitutive models considering ...

This talk gives an overview of ductile damage models in LS-DYNA, an example in implementation of a damage formulation in SAMP as well as gives an insight into an application to a structural part made of thermoplastic material.

This paper describes development of a material model for simulationg crack propagation of casted Aluminum parts. Authors established a new method for predicting the local fracture strain and strength dependent on solidification time ...

The choice of the right material and joining technique in the modern BIW-Design is driven by several factors. The international competition between the OEM’s, new legislations concerning crashrequirements and the current development ...

During recent years the development of new vehicles has had to cope with continuously emerging requirements, implemented by new legislations and consumer tests (e.g. EuroNCAP) to insure occupant and pedestrian protection as well as ...

The deformed shape obtained from car crash FE analysis without considering the rupture of spot welds does not always match with that of actual test if some of the spot welds rupture during crash test. Therefore, simulating the spot ...

This paper presents different modeling techniques to verify and validate the local and global structural deformation for the radiator package and cooling modules. The verification and calibration work for the investigated numerical ...

This second part of the talk "Recent Developments in LS-DYNA" gives further insight into recent developments in LS-DYNA.

Product development is actually aiming a clear strategy: increasing the product variety and decreasing cost and duration of development process. One of the major facts regarding time and costs are the prototype generations for ...

This talk gives an insight into the latest developments of Intel and HPC as well as gives an outlook of further developments.