Heat Transfer in LS-DYNA

Arthur B. Shapiro Livermore Software Technology Corporation LS-Dyna can solve steady state and transient heat transfer problems on 2dimensional parts, cylindrical symmetric parts (axisymmetric), and 3-dimensional parts. Heat transfer can be coupled with other features in LS-DYNA to provide modeling capabilities for thermal-stress and thermal-fluid coupling. This paper presents several examples using LS-DYNA for modeling manufacturing processes (e.g., upseting, extrusion, welding, casting).